باقر سیدعلیپور

of autografts, allografts, xenografts and bioengineered skin substitutes suffer from limitations such as, quantity of donor skin available, donor-site infection, potential risk of disease transmission and rejection of the graft. Given this problem, nanomaterial such as copper nanoparticles (cu-NP) have been receiving considerable research interest because they have high surface area to volume ratio, high stability, clinical safety and antibacterial effect. In this study, we explore the potential therapeutic effect of copper nanoparticle in vitro and in vivo model of wound healing. cultured human fibroblast and endothelial cells were exposed to copper nanoparticles of concentration (1-10-100uM,1-10mM) and sizes(20-40-80nm) for 24,48 and 72 h. MTS assay for cell viability, scratch assay for migration and CFSE for proliferation were performed to assay the wound healing in vitro. Next we check the ability of copper nanoparticle to accelerate wound healing process in animal model. Copper nanoparticle (40nm/10uM)-(80nm 1/100uM) or vehicle were applied to the full-thickness dermal wounds of rat model once daily.Wound size was quantified and the structure of skin were studied with hematoxylin and eosin (H&E) on days 3,7,14,21. Our results revealed that cu-NP (40nm/10uM-80nm(1/100uM) increased endothelial cell migration and proliferation after 48/hour. There was no difference between control and fibroblast group. Moreover, injection of copper nanoparticles in wound bed cause to modulate and accelerate wound healing in full-thickness dermal wounds. taken together the results of the present study showed that copper nanoparticles as a stable, safe and antibacterial component cause to induce and accelerate wound healing in full-thickness dermal wounds .