The encapsulation of 1-methylimidazole (1-MI) was investigated to prepare the latent 1-MI curing agent by using solid epoxy resin as the wall materials. The morphology of 1-MI/solid epoxy microcapsules was investigated by SEM. The thermal behavior of the prepared microcapsule was investigated using differential scanning calorimeter (DSC) and thermal gravimetry analysis (TGA). According to the TGA and DSC curves, the weight loss of the 1-MI/solid epoxy microcapsules although not showing the actual value of the encapsulated 1-MI, but it can be thought-out as the weight of 1-MI that participates in the reaction with the matrix liquid epoxy resin.
